Multilayer PCB Reverse Engineering
While there are any number of companies who claim to be able
to reverse engineer and manufacture dual sided PCB’s, the skills necessary to
create form-fit-function replacements of multilayer pcb’s in the world of
military equipment and systems, reduce this list substantially. Competencies
required for this analysis go well beyond point to point connectivity and
encompass the full spectrum of electrical component and load analysis all in
service of a form-fit-function replacement at the boundary. Keep in mind that
depending on the goals of the project, the new pcb might internally look quite
different than the original pcb design when one considers goals of cost
reduction, obsolescence, and component availability.
What Capabilities are needed for CCA Reverse-Engineering?
When an original TDP is incomplete, incorrect, or not at all
available, then a team like PHT Aerospace is needed to insure that a fully
procurable, cost effective spare can be created and manufactured. To perform
this work, the following capabilities are critical:
1.
Ability to comprehend the complete electrical
specification and tolerances at the margins of the systems under discussion.
2.
Ability to reverse engineer in three dimensions,
the mechanical footprint of the board and surface or attached components so as
to fit perfectly into a preexisting backplane enclosure
3.
Advanced understanding of power consumption and
power distribution across a multilayer pcb.
4.
Ability to produce hardened FPGA’s to replace
older discrete TTL components for better cost and reliability.
5.
Ability to understand environmental requirements
at both component and system level and the ability to qualify the design over a
range that may be as much as -40C to 125C, the full mil spec temperature range.
6.
Complete understanding of both military and commercial avionics qualification processes and documentation.
7.
Ability to build custom test sets for qual of
reengineered system that presents original electrical stimulus for all
functional use cases, at the boundaries.
8.
Ability to manufacture a fully qualified and
functional pcb. A willingness to potentially do this in small production
quantities.
9.
Ability to produce Gerber Files and/or a
complete TDP for resulting design.
10.
Ability to support critical subsystems in the
field when necessary.
Unique PCB Reverse Engineering Capabilities
In just one example, PHT was able to successfully reverse engineer the
pcb for multiple CCA’s for an advanced radar system for the F16 fighter
jet. In this application, existing
scematic documentation was incorrect and original gerber files for the
multilayer pcb were not available. In our analysis, we found small but catastrophic
missing, erroneous, or out-of-date technical information which we had to verify
and correct in order to be able to develop and manufacture a FFF CCA. As part
of this work, PHT Aerospace developed a methodology, which mitigates many of
the known performance risks and resulted in a CCA that worked in the rest of
the system, even though documentation for the rest of that system was not even
available.
For
further information on our team and our capabilities in the military aerospace
arena and beyond, please contact us today.
Content originally posted on: https://www.phtaerospace.com/multilayer-pcb-reverse-engineering/
Content originally posted on: https://www.phtaerospace.com/multilayer-pcb-reverse-engineering/